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Wafers

Auto-ID marking & tracking systems for silicon wafers must meet the most stringent requirements. Two general laser marking methods for wavers are in use today: “Hardmark” and the cleanroom suitable “Softmark” method, which differ in process and depth of material penetration.

 

The manufacturing process for the marked semiconductor components comprises numerous etching and polishing steps. At the end of the process chain, the robustness and high error tolerance of microglyph codes ensures traceability of the whole manufacturing process.

 

 

 

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microglyph® for silicon wafer
marking

 

 

Links DPM:

 

Microglyph® is a registered trademark of Microglyph Technology GmbH
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